Find out what they learned and how to apply the right combination of assessments at the right time to ensure critical high reliability.

Comparing IPC cleanliness assessment methodologies for Class 2 or Class 3 electronic assemblies


Benchmark parameters ensure a uniform procedure, but how do you know if your cleaning system is performing as required on high-reliability production boards with real assemblies?

There are numerous cleanliness assessment techniques that are in accordance with IPC and industry standards. While it is common practice to base assessment method selections on the level of reliability sought, even assemblies that have passed standard analytical tests may still have high contamination areas that can lead to field failures.

 As such, ZESTRON engineers set out to study various cleanliness assessment methodologies to determine what specific insights could be gleaned from the results of each. Methods put to the test included:
  • Visual Inspection
  • Ion Chromatography
  • SIR and C3 Electrical
  • SIR and Localized Board Extraction for Ion Chromatography
  • Accelerated Reliability Testing and Localized Board Extraction
 

 

Critical Reliability Cleanliness Assessments
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