An effective thermal profile is essential for ensuring flux residues are fully volatilized and a quality solder bond is produced, especially when relying on no-clean pastes. However, advances in PCB design, materials and components have made optimizing the reflow process a challenge.

Changes to account for temperature-sensitive devices combined with increasingly densely populated boards often result in unexpected surface temperature variations. Since standard recommended thermal profiles are based on bare boards, these variations could very well compromise the integrity of the soldering process resulting in the presence of exposed flux activators.

 Is the thermal profile you're using sufficient to fully volatilize flux residues and produce quality solder bonds? Find out...

Find more information on:

  • PCB surface temp variation and effect on assembly reliability with No Clean pastes
  • Can ionic flux activators be present on the board surface following a reflow process whereby the peak temperature was not realized?
  • If flux activators are found to be present, would they have a negative impact on the reliability assessment methodology such as SIR analysis
  • if a substrate fails SIR, could a post reflow cleaning process impact the results of the SIR analysis

Thermal Profile Variation and PCB Reliability

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Surface Temperature Variation Could be Putting Your PCB Reliability at Risk.

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